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The Sintratec S3 is the latest addition to the Sintratec All-Material Platform.

Developed for around-the-clock SLS 3D printing, the S3 is a workhorse that packs a punch. Its 30-watt fiber laser fuses powder particles into precise, industrial-grade objects at unprecedented speeds.

The Sintratec Material Core Unit 220 is the new Build Module compatible with all Fusion Modules of the All-Material Platform. The build volume of 15.2 liters makes the MCU-220 the ideal choice for large objects and high-throughput manufacturing. 

Once your print job is completed, simply move the MCU-220 into the dedicated Material Handling Station (MHS) for further processing. The freely accessible work area with an air filtration system gives you a clear view of the object while depowdering. Additionally, it allows you to easily collet, sieve and recycle the unused powder for your next print. 

 

What's Included?
  • 1x S3 Laser Sintering Station (LSS)
  • 1x Material Core Unit (MCU-220)
  • 1x Material Handling Station (MHS)
Features
  • Powerful 30-watt fiber laser
  • Three times faster laser speed than the S2
  • 90% larger build volume than the S2
  • Next-level productivity and throughput
  • High level of process reliability
  • Integrated re-coating & multi-zone heating
  • High-resolution camera for real-time evaluation
  • Integrated screening and mixing function
    Specs

    Material Core Unit 220 (MCU)

    Build Cylinder (Ø x h)

    220 x 400 mm
    8.7 x 15.8 in

    *Effective printing range depends on the application & material.
    *A 
    small area is reserved for temperature sensing.

    Max Part Size. PA12 (Ø x h) 200 x 340 mm
    7.8 x 13.3 in
    Max Part Size, PA12-GF (Ø x h) 200 x 340 mm
    7.8 x 13.3 in
    Max Part Size, TPE (Ø x h) 200 x 300 mm
     7.8 x 11.8 in
    Build Volume Up to 15.2 L
    Build Speed Up to 2.4 cm/hr
    Up to 24 mm/hr
    Up to 0.94 in/hr
    Z-Resolution 0.1 mm
    100 microns
    0.0039 in
    Accuracy

    +/- 0.5mm + 0.5% of part length

    *Tolerances may change depending on part geometry.

    MCU Weight Less than 100 kg
    Less than 200 lbs
    MCU Size (h/w/d) 1.1 x 0.85 x 0.53 m
    43.3 x 33.46 x 20.87 in

     

    S3 Laser Sintering Station (LSS)

      Laser Fiber, 30W @ 1064nm
      Laser Spot Size 0.145mm
      145 microns
      0.006in
      Power 230V,
      11 A max
      50 - 60 Hz
      Laser Life 10,000+ hrs 
      LSS Weight Less than 100 kg
      Less than 200 lbs
      LSS Size (h/w/d) 1.5 x 1 x 0.6 m
      59.1 x 39.4 x 23.6 in

       

      Material Handling Station (MHS)

        Power 230 V
        5 A max
        50 - 60 Hx
        Available Motorized Sieves 140 μm
        314 μm mesh size
        Touchscreen 7"
        3280 x 2464 px
        MHS Weight Less than 100 kg
        Less than 200 lbs
        MHS Size (h/w/d) 1.57 x 1 x 0.6 m
        61.81 x 39.37 x 23.62 in
        Media

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